Huawei's upcoming flagship chip, built on innovative 3D IC stacking and the proprietary Tau Law, achieves performance parity with TSMC's 3nm process while bypassing EUV lithography constraints.
To be perfectly honest, I’d love to see someone actually challenge Apple on this front.
But I’ve been hearing the same shit year after year for like 15+ years. It would be good for the industry if the claims actually paned out for once. There’s no “coping” about it. Just simple truth…
That’s some adorable cope there. I’m old enough remember people making exactly same snide comments about BYD and Tesla a few years ago.
To be perfectly honest, I’d love to see someone actually challenge Apple on this front.
But I’ve been hearing the same shit year after year for like 15+ years. It would be good for the industry if the claims actually paned out for once. There’s no “coping” about it. Just simple truth…
the simple truth is that you haven’t actually used a modern Huawei phone